The Problem: The last major barrier to consumer 2-layer boards is the Via Problem — connecting top and bottom copper layers currently requires dangerous wet-chemical plating processes that are completely unsuitable for home or school environments.
Our solution: a novel CNC toolhead that uses plasma sputtering to directly deposit copper inside vias and traces. This dry process eliminates toxic waste, minimizes consumables, and unlocks precise, automated copper deposition — essentially letting users "spray" copper where it's needed at the atomic level.
The Impact: With this tool, anyone can fabricate complete PCBs safely from their desk, same-day, without a factory. We believe this is the keystone to a new era of localized hardware production, from school labs to orbit.
The Ask: We're raising funding to prototype the first generation plasma toolhead, validate key physics, and position Suneater Labs as the leader in desktop electronics manufacturing infrastructure.
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