## 🧪 R&D Project Outline: Ultrafast Copper Sputtering System ### 🌟 Project Objective Develop a compact, high-rate plasma sputtering platform capable of depositing **25 μm of copper in under 5 minutes** (≥100 nm/s), optimized for rapid prototyping, advanced packaging, and low-volume production applications. ### 📅 Phase 0 – Foundational Research & Spec Definition **Goal:** Define physics constraints, feasibility thresholds, and system-level tradeoffs - [ ] Survey sputter yield & rate literature for Cu targets (RF, DC, HiPIMS) - [ ] Analyze scaling limits of target power density, chamber pressure, and field strength - [ ] Compare sputtering vs electroplating for time, cost, and environmental factors - [ ] Define minimum viable system specs: - Deposition rate: `≥100 nm/s` - Uniformity tolerance: `±5% across 100x100 mm` - Substrate types: `FR4`, `PI`, `Si` - [ ] Draft concept map of required subsystems and interdependencies ### 🔬 Phase 1 – Experimental Platform Development **Goal:** Design and validate a lab-scale deposition system achieving target rate - [ ] Select sputtering configuration (HiPIMS, pulsed DC, or hybrid) - [ ] Design target cooling + erosion geometry - [ ] Simulate and build magnetic field confinement scheme - [ ] Assemble or retrofit vacuum chamber + power supply - [ ] Integrate QCM or OES for in-situ deposition rate measurement - [ ] Establish baseline process at 10–50 nm/s to tune system stability ### ⚡ Phase 2 – Process Optimization to 100+ nm/s **Goal:** Scale the process up to industrial-grade deposition rates - [ ] Increase power density and stabilize plasma at high yield - [ ] Optimize Ar flow and pressure for maximum mean free path - [ ] Tune target–substrate distance and angle for flux efficiency - [ ] Activate substrate heating + biasing for dense, adherent Cu - [ ] Validate 100+ nm/s on test coupons (QCM + profilometry) - [ ] Begin accelerated aging and peel testing ### 🧪 Phase 3 – Reliability & Application Testing **Goal:** Validate copper layer performance under real-world use cases - [ ] Deposit 25 μm copper on PCB, PI, and Si substrates - [ ] Measure adhesion, conductivity, and electromigration resistance - [ ] Run thermal cycling and vibration tests - [ ] Compare with electroplated and evaporated samples - [ ] Evaluate scalability to batch/array-level deposition ### 🚀 Phase 4 – Pilot Systems & Partner Deployment **Goal:** Deploy alpha systems with early adopters and gather feedback - [ ] Build 2–3 compact pilot units - [ ] Create simplified GUI + process presets - [ ] Ship to partner labs (PCB fab, MEMS lab, FHE R&D group) - [ ] Collect field data and adjust system based on feedback - [ ] Prepare documentation for first public release ### 🧠 Phase 5 – IP, Productization & Commercial Readiness **Goal:** Protect key inventions and prepare for scale-up - [ ] File IP on high-rate sputtering process and system design - [ ] Refine BOM and cost structure for <$5K hardware target - [ ] Explore licensing with OEMs / PCB tool manufacturers - [ ] Finalize go-to-market strategy and revenue model ### ✅ Success Criteria (Global) - [ ] 25 μm Cu deposition on 100x100 mm in ≤5 min - [ ] Film resistivity within 10% of bulk Cu - [ ] Uniformity ±5%, adhesion >5 MPa - [ ] Full dry process, compatible with desktop integration - [ ] <$5K target BOM for system production